Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same

A method of manufacturing a weak-magnetic field sensor using printed circuit board manufacturing technique, comprising the steps of:

• preparing a first stacked board by stacking a first conductive layer, a first base layer and a magnetic layer in this order;
• preparing a second stacked board by stacking a second base layer and a second conductive layer on the first stacked board in this order;
• forming via-holes at the first and second conductive layers to electrically connect both the conductive layers to each other;
• providing driving patterns corresponding to the magnetic layer to the first and second conductive layers;
• preparing a pair of third stacked boards by stacking a third base layer and a third conductive layer on a lower surface of the first stacked board and by stacking a third base layer and a third conductive layer on an upper surface of the second stacked board;
• forming through holes at the pair of third conductive layers to electrically connect the pair of third conductive layers to each other;
• and
• providing pickup patterns to the pair of conductive layers.