Perimeter matrix ball grid array circuit package with a populated center

A semiconductor package, comprising:

• a substrate that includes a top surface having a plurality of bond pads, and an exposed external opposite surface including an inner region, an outer region, and a middle region that separates the inner and outer regions;
• a plurality of contacts including a first plurality of contacts and a second plurality of contacts, said first plurality of contacts located in the outer region, and said second plurality of contacts located in the inner region such that the smallest distances between adjacent contacts in the inner and outer regions are smaller than a distance between the inner and outer regions, wherein the middle region is free of contacts;
• and
• an integrated circuit that is mounted to said top surface of said substrate and electrically coupled to said plurality of bond pads, wherein said first and second plurality of contacts are located respectively outside and inside a dimensional profile of said integrated circuit.

A semiconductor package, comprising:

• a substrate which has a top surface and an exposed external bottom surface, said external bottom surface having a plurality of contact pads, said plurality of contact pads consisting only of:
• an outer array of contact pads, each of said contact pads separated from each other by a first distance;
• a center array of contact pads, arranged in a four-by-four array, each of said contact pads separated by a second distance, said center array of contact pads being separated from said outer array of contact pads by a third distance which is larger than said first and second distances;
• and
• a plurality of conductive contacts attached to said contact pads of said substrate.

A semiconductor package, comprising:

• a substrate that includes a top surface having a bus and an exposed external opposite surface including a first, inner region, a second, outer region around the inner region, and a third region that separates the first and second regions;
• a plurality of contacts including a first plurality of contacts and a second plurality of contacts, said first plurality of contacts located in a four-by-four matrix in the first region, and said second plurality of contacts located in the second region such that a smallest distance between adjacent contacts in both the first and second regions are smaller than a distance between the first and second regions, wherein the third region does not have any contacts located therein;
• and
• a plurality of via interconnecting the first bus with a plurality of the first contacts.