Back to results
US 6,747,361 B2Granted
Semiconductor device and packaging method thereof
AssigneeNEC Electronics Corporation
InventorMichihiko Ichinose
Life of this patent
Estimating the term…
Abstract
A semiconductor chip semiconductor device of the present invention is capable of obtaining a high-quality bare chip (HQC) easily and can retain quality without being affected by the surrounding environment. Electrodes formed on the surface of a first resin sealed package for sealing a semiconductor chip are connected to the electrodes of the semiconductor chip and each electrode comprises a mounting area to be connected to an object to be mounted and a testing area for connecting testing equipment.
Claims4
A semiconductor device comprising:
- a first resin package comprising:
- a semiconductor chip;
- a chip electrode on a surface of said semiconductor chip;
- a first resin sealing said semiconductor chip;
- and
- a first package electrode on a surface of said first resin being electrically connected to said chip electrode, said first package electrode comprising a mounting pad and a testing pad provided apart from said mounting pad and said testing pad enabling electrical measurement of said semiconductor chip without using said mounting pad;
- a mounted object connected to said mounting pad, and
- a wiring connecting said mounting pad to said mounting object,
- wherein said mounting pad is arranged along an edge of said first resin package, and wherein said testing pad is arranged at inner position with respect to said mounting pad.
6 more elements
Dependencies are inferred from the claim text.