Conductive hardening resin for a semiconductor device and semiconductor device using the same
AssigneesNEC Electronics Corporation, Sumitomo Bakelite Co., Ltd.
InventorsAkira Fukuizumi, Kazuto Oonami
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Abstract
Conductive hardening resin for a semiconductor device of the present invention contains metal powder for providing electric conduction between electrodes positioned on the front of a semiconductor chip and a wiring material including lead terminals via a conductive plate. The resin has a modulus of elasticity of 2.0×109 Pa or below when hardened. The resin prevents the contact resistance of the metal plate, lead terminals and semiconductor chip from increasing in the event of temperature cycling tests and a pressure cooker tests. Further, the resin frees the metal plate and chip from peel-off and corrosion, respectively.
Claims16
A semiconductor device comprising:
- a semiconductor chip having electrodes formed on a front and a back thereof;
- a wiring material including lead terminals;
- and
- a conductive plate for providing electric conduction between one end of said wiring material and said electrodes via conductive hardening resin containing metal powder;
- wherein said resin has a modulus of elasticity of 2.0×109 Pa or below when hardened.
Dependencies are inferred from the claim text.