Integrated circuit having multiple power/ground connections to a single external terminal

An integrated circuit, comprising:

• at least one integrated circuit die;
• a substrate for mounting and electrically interconnecting the at least one integrated circuit die, wherein the substrate includes a plurality of terminal pads for connection to external terminals of the integrated circuit, and a plurality of bond pads for connection to terminals of the at least one integrated circuit die, and wherein the substrate comprises means for interconnecting at least two power connections from among the plurality of bond pads with to a single one of the terminal pads.

The substrate of claim 15, wherein the integrated circuit is a ball grid array (BGA), wherein the single terminal pad is a circular pad and further comprising a solder ball attached to the circular pad.

An integrated circuit, comprising:

• at least one integrated circuit die;
• and
• means for mounting and electrically interconnecting the at least one integrated circuit die, wherein the means includes a plurality of terminal pads for connection to external terminals of the integrated circuit, and a plurality of bond pads for connection to terminals of the at least one integrated circuit die, wherein the means for mounting has means for interconnecting at least two power connections from among the plurality of bond pads to a single one of the terminal pads.