Flip chip package structure

A flip chip package structure, comprising:

• a substrate having an interior wiring, a plurality of first contacts arranged at a predetermined pitch among each other on a surface, and a trace line area on the surface, beyond the first contacts;
• an IC chip overlying the surface of the substrate, the IC chip electrically connected to the substrate with a plurality of conductive bumps arranged at the predetermined pitch among each other between the IC chip and first contacts;
• an encapsulant between the substrate and IC chip, the encapsulant further filling the pitches among the conductive bumps;
• and
• an electrically protective device having a protruding part and extending part, the protruding part covering the IC chip, the extending part extending over the surface of the substrate with a gap between the extending part and the surface of the substrate not exceeding approximately 40 mil, the extending part further covering the trace line area and connected to the surface of the substrate with a fixing material so as to fasten the electrically protective device to the substrate.