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AssigneeFuji Electric Co., Ltd.
InventorsKazunori Saito, Kimihiro Ashino, Katsumichi Ueyanagi
Estimating the term…
A container for a semiconductor sensor includes a housing body and a cover. On the upper surface of the housing body outer than the pressure detection room, a groove is provided to trap the gel protective material overflowed from the pressure detection room. The housing body and the cover are respectively provided with a recess portion and a protruding portion, engaging with each other, to secure adhesion of the cover to the housing body. The clearance between the housing body and the lead terminal is filled with filler that is formed by applying and curing polyimide resin. The sensor-mounting pit is provided with a relief portion for releasing excess portion of the adhesive, which is used for adhering the pedestal. The excess adhesive is released into the relief portion, to suppress creeping up of the adhesive.
A container for a semiconductor sensor comprising:
A container for a semiconductor sensor comprising:
A container for a semiconductor sensor comprising:
A container for a semiconductor sensor comprising:
A container for a semiconductor sensor comprising:
A container for a semiconductor sensor comprising:
A container for a semiconductor comprising:
A container for a semiconductor sensor comprising a housing body provided with a housing hollow for containing a sensor element, wherein said housing body is provided with a relief portion for releasing excess adhesive from inner wail region of said housing hollow, said adhesive being used for fixing said sensor element to a bottom of said housing hollow.
A method for manufacturing a container for a semiconductor sensor, said container having a hawing body provided with a housing hollow for containing a sensor element and lead terminals penetrating through said housing body from inside to outside, said method comprising steps of:
A method for manufacturing a container for a semiconductor sensor, said container having a housing body provided with a housing hollow for containing a sensor element and lead terminals penetrating said through housing body from inside to outside, said method comprising steps of:
A method for manufacturing a container for a semiconductor sensor, said container having a housing body provided with a housing hollow for containing a sensor element and lead terminals penetrating through said housing body from inside to outside, said method comprising steps of:
A semiconductor sensor device comprising:
A semiconductor sensor device comprising:
A semiconductor sensor device comprising:
A semiconductor sensor device comprising:
A semiconductor sensor device comprising:
A semiconductor sensor device comprising:
A semiconductor sensor device comprising:
A semiconductor sensor device comprising:
A semiconductor sensor device comprising:
A semiconductor sensor device comprising:
A semiconductor sensor device comprising:
A semiconductor sensor device comprising:
A semiconductor sensor device comprising:
A semiconductor sensor device comprising:
A semiconductor sensor device comprising:
A semiconductor sensor device comprising:
A semiconductor sensor device comprising:
A semiconductor sensor device comprising:
A semiconductor sensor device comprising:
Dependencies are inferred from the claim text.