Exposed die molding apparatus
OwnerTodd O. Bolkeninventor
Life of this patent
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Abstract
A method and apparatus for applying a protective ring about the perimeter of an exposed die face. Specifically, a semiconductor chip is coupled to the upper surface of a substrate. The edges of the semiconductor chip are protected by a molding compound which is disposed about the perimeter of the chip and on all or a portion of the substrate. The molding system which is used to apply the protective ring comprises three molding plates and does not require a vacuum-based system to hold the package stationary during the encapsulation process. By not applying a molding compound on the top surface of the semiconductor chip, no height is added to the package.
Claims19
A system for molding a circuit package comprising:
- a first support plate;
- a second support plate proximately positioned with respect to first support plate;
- and
- a cavity plate position between the first support plate and the second support plate, the cavity plate having an aperture configured to accept only a protruding portion of the circuit package such that the protruding portion of the circuit package contacts the first support plate, and wherein the aperture is sized to create a peripheral void about only the protruding portion of the circuit package to permit a molding compound to be disposed thereabout.
Dependencies are inferred from the claim text.