Integrated circuit and laminated leadframe package
AssigneeSemiconductor Components Industries, LLC
InventorsJames Knapp, Stephen St. Germain
Life of this patent
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Abstract
An integrated circuit (100) includes a semiconductor die (102, 103) and a semiconductor package (101) that has a leadframe (20, 40, 60, 80) for mounting the semiconductor die. The leadframe includes a first laminate (20) whose bottom surface (7) is patterned with leads (106, 107, 131, 132) of the integrated circuit. A second laminate (40) has a bottom surface (3) attached to a top surface (5) of the first laminate to electrically coupling the leads to the semiconductor die.
Claims18
An integrated circuit, comprising;
- a first semiconductor die;
- and
- a leadframe including
- a first laminate having exposed surface formed a lead of the integrated circuit and a second surface for mounting the first semiconductor die, and
- a second laminate having a first surface attached to the second surface of the first laminate for electrically coupling the lead to the first semiconductor die.
A semiconductor package for housing a semiconductor die, comprising a leadframe that includes:
- a first conductive laminate having an exposed surface patterned for making external electrical connections, and a second surface for mounting the semiconductor die;
- and
- a second conductive laminate attached to the second surface of the first conductive laminate and providing a signal path from the semiconductor die to the first conductive laminate.
A semiconductor device, comprising:
- a semiconductor die;
- and
- a leadframe formed as stacked conductive laminates, one of the stacked conductive laminates patterned to form an external lead of the semiconductor device and having a surface for mounting the semiconductor die, and another of the stacked conductive laminates patterned for electrically coupling a bonding pad of the semiconductor die to the external lead.
Dependencies are inferred from the claim text.