Collets for bonding of light emitting diodes having shaped substrates

A collet for manipulating a light emitting device having a shared substrate during bonding of the light emitting device having the shaped substrate to a submount, comprising:

• a body having a chamber;
• an opening in the body in communication with the chamber configured such that a portion of the shaped substrate extends into the chamber without contacting the body;
• and
• means, operably associated with the chamber, for engaging the substrate to bond the light emitting device to the submount while maintaining internal shear forces of the substrate resulting from manipulation of the substrate below a shear failure threshold of the substrate.

A collet for manipulating a light emitting device during bonding of the light emitting device to a submount, comprising:

• a body having a chamber therein;
• an opening in the body in communication with the chamber and configured to receive the light emitting device;
• and
• fixed surfaces of the collet at the opening that contact a shaped substrate of the light emitting device, the fixed surfaces defining the opening and being disposed at an angle corresponding to an angle of the surfaces of the shaped substrate that are oblique to a direction of motion of the collet during bonding of the light emitting device to the submount.