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US 6,747,293 B2Granted
Light emitting device
AssigneeKabushiki Kaisha Toshiba
InventorsKoichi Nitta, Kenji Shimomura, Hiroaki Oshio, Takeshi Komatsu
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Abstract
A light emitting device includes a plurality of chips efficiently disposed in a limited space of an opening that has an approximately elliptical or elongate-circular opening shape. The device includes a lead having a slit formed between a portion for bonding a wire to and a portion for mounting chips on, thereby to prevent extrusion of an adhesive and eliminate defective bonding.
Claims19
A light emitting device comprising:
- a lead;
- a resin portion embedding at least a part of said lead;
- a first semiconductor light emitting element mounted on said lead in an opening formed in said resin portion;
- a semiconductor element mounted on said lead in said opening;
- a wire connecting said first semiconductor light emitting element and said lead;
- and
- a silicone resin provided in said opening to enclose said first semiconductor light emitting element and said semiconductor element, said silicone resin having a hardness not lower than 50 in JISA value,
- said lead having a slit formed therein between a portion where said first semiconductor light emitting element is mounted and a portion where said wire is connected, while said portion where said first semiconductor light emitting element is mounted is electrically continuous with said portion where said wire is connected.
5 more elements
A light emitting device comprising:
- a first lead;
- a second lead;
- a resin portion embedding at least a part of said first and second leads;
- a first semiconductor light emitting element mounted on said first lead in an opening formed in said resin portion;
- a semiconductor element mounted on said second lead in said opening;
- a first wire connecting said first semiconductor light emitting element and said second lead;
- a second wire connecting said semiconductor element and said first lead;
- and
- a silicone resin provided in said opening to enclose said first semiconductor light emitting element and said semiconductor element, said silicone resin having a hardness not lower than 50 in JISA value,
- said first lead having a first slit formed therein between a portion where said first semiconductor light emitting element is mounted and a portion where said second wire is connected,
- said second lead having a second slit formed therein between a portion where said semiconductor element is mounted and a portion where said first wire is connected.
8 more elements
A light emitting device comprising:
- a first lead;
- a second lead;
- a resin portion embedding at least a part of said first and second leads;
- a first semiconductor light emitting element mounted on said first lead in an opening formed in said resin portion;
- a semiconductor element mounted on said first lead in said opening;
- a first wire connecting said first semiconductor light emitting element and said second lead;
- a second wire connecting said semiconductor element and said second lead;
- and
- a silicone resin provided in said opening to enclose said first semiconductor light emitting element and said semiconductor element, said silicone resin having a hardness not lower than 50 in JISA value,
- said opening having a substantially elliptical or elongate-circular opening shape,
- said first semiconductor light emitting element and said semiconductor element being arranged along a longer axis or a shorter axis of said elliptical or elongate-circular opening.
8 more elements
Dependencies are inferred from the claim text.