X-ray image pickup apparatus and method of making the same
AssigneeHamamatsu Photonics K.K.
InventorsHarumichi Mori, Ryuji Kyushima, Kazuki Fujita, Masahiko Honda, Takuya Homme
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Abstract
In an X-ray image pickup apparatus comprising first and second semiconductor image sensor chips 14A, 14C arranged adjacent each other on a base plate 20, and a single scintillator panel 40 disposed on the first and second semiconductor image sensor chips, respective planes including surfaces of photosensitive regions of the first and second semiconductor image sensor chips have normals intersecting at a predetermined angle.
Claims13
An X-ray image pickup apparatus comprising first and second semiconductor image sensor chips arranged adjacent each other on a base plate, and a scintillator panel disposed on said first and second semiconductor image sensor chips;
- wherein respective planes including surfaces of photosensitive regions of said first and second semiconductor image sensor chips have normals intersecting at a predetermined angle.
A method of making an X-ray image pickup apparatus comprising:
- a first step of measuring an extent of warpage of a scintillator panel;
- a second step of applying an adhesive onto a base plate;
- a third step of inclining a plurality of semiconductor image sensor chips according to said extent of warpage and disposing said plurality of semiconductor image sensor chips on said adhesive;
- a fourth step of disposing said scintillator panel on said plurality of semiconductor image sensor chips;
- and
- a fifth step of disposing and pressing a buffer member on said scintillator panel.
Dependencies are inferred from the claim text.