Assembly of imaging arrays for large format documents
AssigneeXerox Corporation
InventorKraig A. Quinn
Life of this patent
Estimating the term…
Abstract
An imaging apparatus is formed of two or more imaging subarrays. Each imaging subarray is formed of a printed wiring board containing semiconductor imaging chips. The end chip of each board projects beyond the edge of the board. The imaging subarrays are joined together so that the projecting end chips may be closely spaced from one and another, without the circuit boards contacting one another. Glass tie bars formed of a low thermal expansion glass secure the boards to one another. A light curable adhesive secures each tie bar to the printed wiring board.
Claims11
An imaging apparatus, comprising:
- a first imaging subarray comprising a first printed wiring board having a joining end and a plurality of first semiconductor imaging chips mounted on the first printed wiring board, including a first end chip, wherein a portion of the first end chip projects beyond the joining end of the first printed wiring board;
- a second imaging subarray comprising a second printed wiring board having a joining end, and a plurality of second semiconductor imaging chips mounted on the second printed wiring board, including a second end chip, wherein a portion of the second end chip projects beyond the joining end of the second printed wiring board;
- and
- a glass tie bar connecting the first and second imaging subarrays, wherein:
- a first portion of the glass tie bar is attached to the first printed wiring board with a light-curable adhesive;
- and
- a second portion of the glass tie bar is attached to the second printed wiring board with a light-curable adhesive.
A method of forming an imaging apparatus, the method comprising:
- forming a first imaging subarray comprising a first printed wiring board having a joining end and a plurality of first semiconductor imaging chips mounted on the first printed wiring board, including a first end chip, wherein a portion of the first end chip projects beyond the joining end of the first printed wiring board;
- forming a second imaging subarray comprising a second printed wiring board having a joining end and a plurality of second semiconductor imaging chips mounted on the second printed wiring board, including a second end chip, wherein a portion of the second end chip projects beyond the joining end of the second printed wiring board;
- bringing the first imaging subarray into proximity with the second imaging subarray so that the first end chip is immediately adjacent the second end chip;
- applying light-curable adhesive to the first printed wiring board and to the second printed wiring board;
- placing a glass tie bar so that a first portion of the tie bar contacts the light-curable adhesive on the first printed wiring board, and a second portion of the tie bar contacts the light-curable adhesive on the second printed wiring board;
- and
- directing light onto the light-curable adhesive to cure the light-curable adhesive.
Dependencies are inferred from the claim text.