Alternative to through-hole-plating in a printed circuit board
AssigneeUnisys Corporation
InventorsDaniel A. Jochym, Robert H. Fix
Life of this patent
Estimating the term…
Abstract
A printed circuit board (PCB) comprises a number of electrically conductive layers. Instead of coating, or plating, a PCB through-hole with an electrically conductive material to form a via (for the purpose of connecting together signal paths across the electrically conductive layers)—the via is formed by placing a conductive stake, or conductive pin, in the through-hole.
Claims6
A multilayer printed circuit board with at least one through hole perpendicular to the plane of the layers of the multiplayer printed circuit board, said multiplayer printed circuit board having at least four trace layers with foil conductors therein and non-conductive materials between each of said four trace layers, said multilayer printed circuit board having lodged within said through hole two conductive stakes, each of said two conductive stakes having an inner side, the inner side of each stake directed toward a center of said through hole, there being a space within said through hole separating said inner sided of said two stakes, said two conductive stakes providing electrical contact to at least two conductive foils in two of said trace layers separated by a layer of non-conductive material, thus establishing by each said conductive stake an electrical pathway between said foils.
A multilayer printed circuit board with at least two partial through holes, aligned in a perpendicular axis to the plane of the layers of the multiplayer printed circuit board, said multilayer printed circuit board having at least four trace layers with foil conductors therein and non-conductive materials between each of said four trace layers, said multilayer printed circuit board having lodged within each said partial through hole a conductive stake, each of said two conductive stakes having an inner side, the inner side of each stake directed toward the partial through hole in which the other conductive stake is lodged, there being at least a portion of a layer of said multilayer circuit board separating said inner sides of said two conductive stakes, said two conductive stakes providing electrical contact to at least two conductive foils in two of said trace layers separated by a layer of non-conductive material, thus establishing by each said conductive stake an electrical pathway between said foils on opposing sides of said multilayer circuit board, separated by said at least a portion of a layer.
A printed circuit board comprising:
- at least three layers of material, such that two of the layers of material are electrically conductive and the third layer is an electrical insulator and wherein the insulating layer is disposed between the conductive layers;
- and
- at least one conductive stake inserted into a substantially round through hole of a certain diameter established in the printed circuit board for forming a via or electrically connecting foils from the two conductive layers together;
- wherein the conductive stake has a filled polygonal shape when viewed in cross-section such that at least one corner of said polygonal shape when inserted into said through hole extend beyond said certain diameter so as to establish contact with the foils for forming the via.
Dependencies are inferred from the claim text.