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US 6,747,216 B2Granted
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
AssigneeIntel Corporation
InventorsGary A. Brist, Gary Baxter Long, Daryl A. Sato
Life of this patent
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Abstract
An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes.
Claims10
An apparatus, comprising:
- a plurality of metalized planes;
- one or more dielectric layers separating the plurality of metalized planes;
- and
- one or more conductive trenches connecting more than two of the plurality of metalized planes.
1 more element
Dependencies are inferred from the claim text.