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AssigneeToagosei Co., Ltd.
InventorsShin Takahashi, Masashi Yamada
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An adhesive, a flocked weather strip, and a process for producing the weather strip. The adhesive is a moisture-curing reactive hot-melt adhesive for weather strip flocking, which comprises as the main component a urethane prepolymer containing isocyanate groups, the adhesive having a dielectric constant at 25° C. of 3 to 10 and a melting point of 40° C. to 150° C. The flocked weather strip comprises a substrate and piles flocked thereon through the moisture-curing reactive hot-melt adhesive. The process for producing the flocked weather strip comprises thermally melting the moisture-curing reactive hot-melt adhesive, applying the melt to a substrate in a thickness of 40 to 150 μm, electrostatically flocking piles in the resulting layer of the molten adhesive, cooling the adhesive to solidify the same and fix the flocks to the substrate, and then cutting the substrate into a given size. The adhesive is suitable for use in the flocking of a weather strip substrate and enables piles flocked in a melt of the adhesive to tenaciously bond to the weather strip substrate in a short period of time. The weather strip has excellent sliding resistance and is especially suitable for use in motor vehicles.
A moisture-curing reactive hot-melt adhesive for weather strip flocking, which comprises a urethane prepolymer as the main component, which contains isocyanate groups, and a silane coupling agent in an amount of 1 to 20% by weight based on the total weight of the adhesive, wherein said adhesive has a dielectric constant at 25° C. of 3 to 10, a melting point of 40° C. to 150° C. and a melt viscosity of 200 to 100,000 mPa·s/120° C.
Dependencies are inferred from the claim text.