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US 6,746,962 B2Granted
Method for fabricating a semi-conductor device having a tungsten film-filled via hole
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsTakenobu Kishida, Takeshi Harada, Toru Hinomura, Hiromitsu Abe, Mitsunari Satake, Kenichi Kunimitsu
Life of this patent
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Abstract
A first metal film is deposited on a bottom and a wall of a recess formed in an insulating film on a semiconductor substrate. A second metal film is filled in the recess on the first metal film. The second metal film is formed from a polycrystalline tungsten film having a crystal plane of a (110) orientation.
Claims10
A method for fabricating a semiconductor device comprising the steps of:
- (a) filling a metal film in a recess formed in an insulating film deposited over a semiconductor substrate;
- and
- (b) removing a portion of said metal film present on said insulating film by CMP, so that said metal is retained in said recess,
- wherein said metal film is composed of a tungsten film which is oriented to a crystal plane of the (110) orientation, and
- wherein said step (b) includes a sub step of detecting an end point of said CMP by detecting a change of a rotation torque value in the CMP.
2 more elements
A method for fabricating a semiconductor device comprising the steps of:
- (a) depositing a first metal film on an insulating film formed over a semiconductor substrate and a bottom and a wall of a recess formed in said insulating film;
- (b) filling a second metal film in said recess on said first metal film;
- and
- (c) removing a portion of both said second metal film and said first metal film being present on said insulating film by CMP, so that said second metal film and said first metal film are retained in said recess,
- wherein said second metal film is composed of a tungsten film which is oriented to a crystal plane of(110) orientation with a half-value width of 4 degrees or less, and
- wherein said step (c) includes a sub step of detecting an end point of said CMP by detecting a change of a rotation torque value in the CMP.
3 more elements
Dependencies are inferred from the claim text.