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US 6,746,946 B2Granted
Process and apparatus for manufacturing printed circuit boards
OwnerN. Edward Berginventor
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Abstract
A method and apparatus for producing printed circuits utilizing direct printing methods to apply a pattern mask to a substrate. The pattern mask may be an etch resist mask for forming conductive pathways by an etching process, or the pattern mask may be a plating mask with conductive pathways being formed by a plating operation. The process of the present invention is applicable to forming both single-sided and double sided printed circuit boards.
Claims22
A process for forming a circuit board comprising:
- supplying a non-conductive substrate having a top surface with a conductive layer disposed thereon;
- cleaning a surface of the conductive layer;
- printing a first patterned etch resist mask directly onto at least a portion of the conductive layer, leaving at least an exposed portion of the conductive layer;
- setting the printed patterned etch resist mask;
- removing the exposed portion of the conductive layer;
- removing the patterned etch resist mask from the remainder of the conductive layer.
3 more elements
Dependencies are inferred from the claim text.