Temperature controlling method, thermal treating apparatus, and method of manufacturing semiconductor device

A temperature control method of controlling an apparatus, which includes a process chamber, a heating apparatus including at least one heating zone for heating a treatment target provided in said process chamber, and first temperature detectors, at least one of said first temperature detectors provided for each of said at least one heating zone for detecting heating temperatures provided by said heating apparatus at first predetermined locations,

• wherein a power supply of said at least one heating zone is independently adjusted,
• wherein said heating apparatus is controlled on a basis of first detected temperatures detected by said first temperature detectors and a first target temperature for said first detected temperatures, and
• wherein a plurality of second temperature detectors are disposed at second predetermined locations, number of which is larger than that of said at least one heating zone and which are closer to said treatment target than said first predetermined locations,
• said method, comprising:
• comparing second detected temperatures detected by said second temperature detectors with a second target temperature to obtain corrective values for said first target temperature;
• and
• correcting said first target temperature by said corrective values.

A method of manufacturing a semiconductor device, in which a target substrate is subjected to a heating process by controlling a heating apparatus, including at least two heating zones, in such a manner that temperatures detected at predetermined locations equal a target temperature, said method, comprising:

• detecting temperatures at said predetermined locations, a number of which is larger than a number of said at least two heating zones and at least one of which is located in each of said at least two heating zones;
• and
• controlling said heating apparatus in such a manner that said target temperature, detected at said predetermined location, falls between a maximum value and a minimum value,
• wherein power supplies of said at least two heating zones are independently adjusted.

A temperature control method for a furnace, including a plurality of heating zones, comprising:

• controlling a first temperature of each of said plurality of heating zones, detected by a corresponding plurality of first temperature detectors, by a corresponding one of a plurality of heating elements to equal a first target temperature;
• detecting a plurality of second temperatures at each of a plurality of second temperature detectors, a number of said plurality of second temperature detectors being greater than a number of said plurality of first temperature detectors, said plurality of second temperature detectors being located in greater proximity to a target than said plurality of first temperature detectors, and at least one of said plurality of second temperature detectors being located in each of said plurality of heating zones;
• independently and sequentially varying said first temperature of each of said plurality of heating zones to a varied first temperature, which does not equal said first target temperature;
• subsequently detecting a plurality of varied second temperatures by each of said plurality of second temperature detectors;
• determining an interference matrix, M, in a temperature controller that defines a mathematical relationship between a first difference of said first temperature of each of said plurality of heating zones and a second difference of each of said plurality of second temperatures;
• and
• minimizing errors, P0, between said plurality of second temperatures and said first target temperature of each of said plurality of heating zones.

A temperature control method of controlling a heating apparatus that includes a plurality of heating zones for heating a treatment target located in a process chamber and each of said plurality of heating zones includes one of a plurality of first temperature detectors located at one of a plurality of first predetermined locations, said temperature control method, comprising:

• controlling each of a plurality of first temperatures that correspond respectively to each of said plurality of first predetermined locations, such that a plurality of first target temperatures is attained;
• and
• comparing each of a plurality of second temperatures detected by a corresponding one of a plurality of second temperature detectors with a second target temperature to obtain corrective values for said plurality of first target temperatures,
• wherein said plurality of second temperatures are detected at a corresponding plurality of second predetermined locations, a number of which is larger than that of said plurality of heating zones and which are closer to said treatment target than said plurality of first predetermined locations.