Fabricating process of non-gap 3-D microstructure array mold core
AssigneeIndustrial Technology Research Institute
InventorsKun-Lung Lin, Min-Chieh Chou, Cheng-Tang Pan
Life of this patent
Estimating the term…
Loading patent…
AssigneeIndustrial Technology Research Institute
InventorsKun-Lung Lin, Min-Chieh Chou, Cheng-Tang Pan
Estimating the term…
A process of fabricating a non-gap 3-D microstructure array mold core comprises a first step in which a buffer layer is coated on a substrate. A photomask layer is then coated of the buffer layer. A pattern is subsequently formed on the photomask by photo-lithography. The patterned photomask layer is subjected to a reflow by which a microstructure array is formed on the photomask layer. The microstructure array is coated with a metal conductive layer. The microgaps of the microstructure array are eliminated by an electrocasting layer which is coated on the microstructure array. The non-gap microstructure array mold core so fabricated is made into a metal molding tool by microinjection molding or microthermo-pressure molding.
A process for fabricating a non-gap 3-D microstructure array mold core, said process comprising the following steps of:
Dependencies are inferred from the claim text.