Use of polyimide for adhesive layers, lithographic method for producing microcomponents and method for producing composite material

A lithographic method for producing microcomponents with component structures in the sub-millimeter range comprising the steps of:

• applying a structurable adhesive layer to a metal layer and a layer of photostructurable epoxy resin to the adhesive layer, structuring the epoxy resin by means of selective exposure and removing the unexposed areas, and filing the gaps between the resin structures with metal through an electrodeposition process, wherein an adhesive layer of photostructurable polyimide or a photostructurable polyimide mixture with a thickness of <1 μm is used, and
• prior to application of the epoxy resin, the adhesive layer is selectively exposed and the unexposed areas are removed,
• the epoxy resin is then applied all over the adhesive layer and the uncovered metal layer,
• essentially those areas of the epoxy resin under which the adhesive layer is located are exposed, and
• the unexposed areas of the epoxy resin are subsequently removed to uncover the metal layer.