US 6,746,579 B2 · Electrolytic gold plating method and apparatus therefor

Abstract

An object of the present invention is to provide a method of monitoring deterioration of an electrolytic gold plating solution which can always stably performing gold plating by continuously detecting a deterioration state of the gold sulfite complex plating solution, and to provide an apparatus for monitoring the deterioration of the electrolytic gold plating solution. The present invention is characterized by an electrolytic gold plating method for performing electrolytic gold plating on a surface of a substrate body using a gold sulfite plating solution, wherein the gold plating is performed while deterioration of the plating solution is being always or intermittently detected during plating. Further, the present invention is characterized by an electrolytic gold plating apparatus for performing electrolytic gold plating on a surface of a substrate body using a gold sulfite plating solution, which comprises a detecting means for always or intermittently detecting deterioration of the plating solution and a monitoring unit for displaying the deterioration degree.

Claims9

Dependent claims

An electrolytic gold plating apparatus for performing electrolytic gold plating on a surface of a substrate body using a gold sulfite plating solution, comprising a detector configured to detect a deterioration degree of said gold sulfite plating solution in which light is irradiated to said gold sulfite plating solution and light intensity is measured after the light is irradiated.

An electrolytic gold plating apparatus for performing electrolytic gold plating on a surface of a substrate body in a gold plating bath containing a gold sulfite plating solution, which comprises:

an absorptiometer for irradiating light to said plating solution and measuring a light intensity after said irradiation;
a pH meter for measuring a pH of said plating solution;
a concentration measurement unit consisting of an automatic titrator or a liquid chromatograph for measuring a concentration of at least one of sulfurous acid or sulfuric acid in said plating solution;
pipes for individually connecting said absorptiometer, said pH meter and said concentration measurement unit to said gold plating bath, said pipes making said plating solution to pass through;
and
a personal computer for displaying quality of said plating solution based on a value measured by at least one of said absorptiometer, said pH meter and said concentration measurement unit.

3 more elements

Dependencies are inferred from the claim text.

Electrolytic gold plating method and apparatus therefor

Life of this patent

Electrolytic gold plating method and apparatus therefor

Life of this patent

Abstract

Claims9