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US 6,746,559 B2Granted
Method and apparatus for separating composite member using fluid
AssigneeCanon Kabushiki Kaisha
InventorsKazuaki Ohmi, Takao Yonehara, Kiyofumi Sakaguchi, Kazutaka Yanagita
Life of this patent
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Abstract
To separate a composite member consisting of a plurality of bonded members without destructing or damaging it, a fluid is jetted against the composite member from a nozzle to separate it into a plurality of members at a position different from a bonding position.
Claims13
A method of producing a semiconductor substrate comprising the steps of:
- preparing a composite member formed by bonding a first substrate comprising a non-porous semiconductor layer on a porous layer to a second substrate so that the non-porous semiconductor layer is positioned inside the composite member;
- applying a pressure by a fluid to a side surface of the composite member, the side surface having a recessed or narrow gap, to separate the composite member at the porous layer at a position different from the bonding interface between the first and second substrates;
- and
- after the separation step, subjecting the non-porous semiconductor layer transferred onto the second substrate to heat treatment in an atmosphere containing hydrogen.
1 more element
A method of producing a semiconductor substrate comprising the steps of:
- preparing a composite member formed by bonding a first substrate comprising a non-porous semiconductor layer on an ion-implanted layer to a second substrate so that the non-porous semiconductor layer is positioned inside the composite member;
- applying a pressure by a fluid to a side surface of the composite member, the side surface having a recessed or narrow gap, to separate the composite member at the ion-implanted layer at a position different from the bonding interface between the first and second substrates;
- and
- after the separation step, subjecting the non-porous semiconductor layer transferred onto the second substrate to heat treatment in an atmosphere containing hydrogen.
1 more element
Dependencies are inferred from the claim text.