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US 6,746,498 B1Granted
Abrasive with a modified surface and a method for making it
AssigneeIntel Corporation
InventorMark F. Buehler
Life of this patent
Estimating the term…
Abstract
A composition is described that comprises an abrasive, and a hydrocarbon containing component that is coupled to the abrasive. Such a composition may be included in a slurry that is used to polish a substrate, when forming a semiconductor device. Also described is a method for modifying a surface of an abrasive that comprises coupling a hydrocarbon containing component to the surface of the abrasive.
Claims2
A method of forming a semiconductor device comprising:
- polishing an ultra low-k dielectric layer with a slurry that comprises a hydrocarbon ligand that is coupled to the surface of a colloidal silica abrasive, the ligand providing a soft stop for the abrasive, which decreases the polish rate.
Dependencies are inferred from the claim text.