Polishing method and polishing apparatus
AssigneeEbara Corporation
InventorsHiroomi Torii, Hiroshi Kojima, Suguru Ogura, Soichi Isobe
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AssigneeEbara Corporation
InventorsHiroomi Torii, Hiroshi Kojima, Suguru Ogura, Soichi Isobe
Estimating the term…
The present invention relates to a polishing method and apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. A polishing liquid is supplied onto a polishing cloth attached on a turntable, and a semiconductor wafer to be polished is held by a top ring. The turntable and the top ring are rotated, respectively. A surface, to be polished, of the semiconductor wafer held by the top ring is pressed against the polishing cloth on the turntable to polish the semiconductor wafer. When a polished semiconductor wafer held by the top ring is to be removed from the polishing cloth on the turntable, a relative speed of the turntable and the top ring is increased as compared with a relative speed of the turntable and the top ring at a period of polishing.
A polishing method comprising:
A polishing apparatus comprising:
A polishing apparatus comprising:
A polishing method comprising:
A polishing apparatus comprising:
A polishing apparatus comprising:
Dependencies are inferred from the claim text.