Polishing pad with release layer

A multi-layered polishing pad capable of substantially conforming to a workpiece surface global topography while not substantially conforming to a workpiece surface local topography during surface modification of the workpiece using a polishing device, the multi-layered polishing pad comprising:

• a three-dimensional, textured, fixed abrasive layer;
• a sub-pad including at least one resilient layer and at least one rigid layer generally coextensive with the resilient layer, the rigid layer interposed between the resilient layer and the abrasive layer;
• and
• at least one attachment layer interposed between the abrasive layer and the resilient layer, wherein the attachment layer releasably joins the abrasive layer to at least a portion of the sub-pad, wherein the attachment layer comprises at least one layer selected from the group consisting of:
• a low adhesion backsize material;
• a release liner;
• a stretch releasable adhesive;
• a mechanical attachment device;
• and
• combinations thereof.

A method of modifying an exposed surface of a semiconductor wafer, comprising the steps of:

• contacting the surface with a multi-layered polishing pad comprising:
• a polishing layer;
• at least one sub-pad layer adjacent the polishing layer;
• and
• an attachment layer interposed between and releasably joining the polishing layer and at least a portion of the at least one sub-pad layer, wherein the attachment layer comprises at least one layer selected from the group consisting of:
• a low adhesion backsize material;
• a release liner;
• a stretch releasable adhesive;
• a mechanical attachment device;
• and
• combinations thereof;
• and
• relatively moving the wafer and the multi-layered polishing pad thereby modifying the surface of the wafer.

A method of modifying an exposed surface of a semiconductor wafer, comprising the steps of:

• contacting the surface with a multi-layered polishing pad comprising:
• a three-dimensional, textured, fixed abrasive layer;
• a sub-pad including at least one resilient layer and at least one rigid layer generally coextensive with the resilient layer, the rigid layer interposed between the resilient layer and the abrasive layer;
• and
• at least one attachment layer interposed between the abrasive layer and the resilient layer, wherein the attachment layer releasably joins the abrasive layer to at least a portion of the sub-pad, and wherein the attachment layer comprises at least one layer selected from the group consisting of:
• a low adhesion backsize material;
• a release liner;
• a stretch releasable adhesive;
• a mechanical attachment device;
• and
• combinations thereof;
• and
• relatively moving the wafer and the multi-layered polishing pad thereby modifying the surface of the wafer.

A method of replacing a polishing surface of a multi-layered polishing pad used with a polishing device for modifying the exposed surface of a semiconductor wafer, the method comprising the steps of:

• providing a multi-layered polishing pad for attachment to a polishing device, the polishing pad comprising:
• a polishing layer having a polishing surface for contacting a semiconductor wafer during a polishing process;
• at least one sub-pad layer adjacent the polishing layer;
• and
• an attachment layer interposed between and releasably joining the polishing layer and at least a portion of the at least one sub-pad layer, wherein the attachment layer comprises at least one layer selected from the group consisting of:
• a low adhesion backsize material;
• a release liner;
• a stretch releasable adhesive;
• a mechanical attachment device;
• and
• combinations thereof;
• removing the polishing layer of the multi-layered polishing pad when the polishing surface becomes unusable by detaching the polishing layer from the at least one sub-pad layer at the attachment layer and leaving at least a portion of the at least one sub-pad layer attached to the polishing device;
• and
• attaching another polishing layer having a usable polishing surface to the portion of the sub-pad layer attached to the polishing device.