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US 6,746,231 B1Granted
Thermal equalizing system for injection molding apparatus
OwnerSalvatore Benenatiinventor
Life of this patent
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Abstract
Methods and apparatus for implementing a thermal equalizing system for use within a hot runner system of a plastic injection molding apparatus are described. The thermal equalizing system employs at least one thermal fluid circulating circuit which uses a heat transfer fluid to remove excess heat from overheated areas within the injection molding apparatus and/or to add heat to under heated areas within the injection molding apparatus.
Claims9
An injection molding apparatus adapted to convey molten plastic material, said molding apparatus comprising:
- a body including a through passage adapted for the conveyance of molten plastic material and at least one closed loop heat transfer fluid circuit, said closed loop heat transfer fluid circuit including a plurality of interconnected heat transfer fluid cavities filled with a heat transfer fluid;
- and at least one unidirectional fluid check valve interconnecting two of said heat transfer fluid cavities, said heat transfer fluid flowing through the unidirectional fluid check valve in a single direction in response to heat transfer fluid pressure differential caused by uneven heating of said body, the flowing of said heat transfer fluid causing heat transfer fluid circulation in said closed loop heat transfer fluid circuit.
Dependencies are inferred from the claim text.