Low strain chip removal apparatus
AssigneeInternational Business Machines Corporation
InventorsRaschid J. Bezama, Govindarajan Natarajan, Robert W. Pasco
Life of this patent
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Abstract
A method and structure for a chip detach apparatus and method that limits the solder ball maximum shear rate and, more particularly, that delays the application of shear force until a minimum predefined temperature is reached. The chip detach apparatus and method can be applied to chips with high solder ball counts, chips with small solder ball sizes, and chips with weak surface strength. The chip detach apparatus and method measures and accounts for variability in the electronic module manufacturing and assembly.
Claims20
A device removal apparatus comprising:
- a first member adopted to contact a device to be removed from a substrate;
- and
- a damper comprising a damper reservoir maintaining damper material connected to said first member and being adapted to limit a shear rate of said first member.
A device removal apparatus comprising:
- a first member adapted to contact a device to be removed from a substrate;
- a damper connected to said first member and being adapted to limit a shear rate of said first member;
- and
- a biasing device connected to said first member and being adapted to deliver a shear force,
- wherein said device is a test module, wherein said test module calibrates said shear force.
A device removal apparatus comprising:
- a first member adapted to contact a device to be removed from a substrate;
- and
- a damper connected to said first member and being adapted to limit a shear rate of said first member, wherein said damper comprises a temperature dependent material, such that said limit on said shear rate is temperature dependent.
A device removal apparatus comprising:
- a first member adapted to contact a device to be removed from a substrate;
- a damper connected to said first member and being adapted to limit a shear rate of said first member, wherein said damper comprises:
- a damper skate connected to first member;
- and
- a damper reservoir maintaining damper material in which said damper skate is positioned.
A device removal apparatus comprising:
- a first member adapted to contact a device to be removed from a substrate;
- a thermally activated device connected to said first member and being adapted to move said first member;
- and
- a damper comprising a damper reservoir maintaining damper material connected to said first member and being adapted to limit a shear rate of said first member.
A device removal apparatus comprising:
- a first member adapted to contact a device to be removed from a substrate;
- and
- a thermally activated device connected to said first member and being adapted to move said first member,
- wherein said thermally activated device includes gas loaded containers.
A device removal apparatus comprising:
- a first member adapted to contact a device to be removed from a substrate;
- a thermally activated device connected to said first member and being adapted to move said first member;
- and
- a biasing device connected to said first member, wherein said thermally activated device moves said first member in a first direction, and said biasing device is adapted to move said first member in a direction opposite said first direction.
A method for removing a device from a substrate comprising:
- applying a shear force to a first member adapted to remove said device from said substrate;
- and
- limiting said shear force by applying a damping force to said first member, wherein said damping force is applied through a damper reservoir maintaining damper material.
A method for removing a device from a substrate comprising:
- applying a shear force to a first member adapted to remove said device from said substrate;
- and
- limiting said shear force by applying a damping force to said first member,
- wherein said applying of said damping force comprises:
- connecting said first member to a damper skate;
- and
- positioning said damper skate in a damper reservoir, wherein said damper reservoir includes damper material.
Dependencies are inferred from the claim text.