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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsFumio Echigo, Hideki Higashitani, Daizo Andoh, Noritake Fukuda, Yasuhiro Nakatani, Tadashi Nakamura
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Removable mask films 303 are formed on the both sides of the substrate having the adhesive layer 302 by applying and drying a resin varnish 304 including a ultraviolet-absorbing agent, and fine through holes 306 are formed by using a third harmonics YAG solid-state laser light with a relatively short wavelength not longer than that in the ultraviolet range in such a way that the effects of such a residual strain as the conventional embodiment forming a removable mask film by a laminating process may be decreased as well as the more fine hole drilling compared with conventional embodiment using the carbon dioxide gas laser with a relatively long wavelength may be performed.
A process for forming a removable film having removability wherein said removability enables said film to be removed from said substrate after said film is drilled by laser light along with said substrate on the surface of said substrate and optical absorptivity absorbing laser light in a range of wavelength not longer than that in the ultraviolet range by applying and drying a resin varnish, which exerts removability after drying and has optical absorptivity upon laser light in a range of wavelength not longer than that in the ultraviolet range, on the surface of said substrate.
A process for the manufacturing of a circuit board comprising the steps of:
Dependencies are inferred from the claim text.