Method for loading solder balls into a mold
AssigneeInternational Business Machines Corporation
InventorLannie R. Bolde
Life of this patent
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Abstract
A method and apparatus for loading solder balls into a mold. Solder balls are loaded into a reservoir having multiple exit ports. A removable mold is fitted into the apparatus and the reservoir is passed across the top of the mold while solder balls are fed into cavities in the mold. After the reservoir has advanced across the mold and the mold cavities are filled with solder balls, the reservoir is reset as a roller is simultaneously guided across the mold to seat the solder balls firmly within the mold. Alternatively, the roller may be applied to the solder balls while the reservoir advances across the mold, or both as the the reservoir is advanced and when it is returned to its original position.
Claims6
A method for loading solder balls into a mold comprising the steps of:
- loading solder balls into a reservoir having multiple feeder exit ports aligned in a first direction;
- aligning a removable mold adjacent to the reservoir, the mold having an upper side, a lower side, and a plurality of cavities aligned in a second direction with each of the feeder exit ports;
- advancing the reservoir across the upper side of the mold in the second direction;
- allowing the balls to be seated into the cavities;
- returning the reservoir to its original position while simultaneously advancing a roller over the seated balls with pressure in a third direction sufficient to form a flat spot on the top of each ball;
- and
- removing the mold with seated solder balls.
Dependencies are inferred from the claim text.