Burn-in board with adaptable heat sink device
AssigneeReliability Incorporated
InventorsJames E. Johnson, Ronald J. Darcy
Life of this patent
Estimating the term…
Abstract
A system and method for burning-in an integrated circuit comprises a socket capable of receiving and supporting the IC, electrical leads in the socket for connecting to corresponding leads on the chip, and a heat sink in thermal contact with a cooling medium. A first thermal interface provides releasable thermal contact between the integrated circuit in the socket and a resiliently mounted heat absorbing member. A second thermal interface is provided between the heat absorbing member and the heat sink.
Claims14
A socket for testing an integrated circuit, comprising:
- a socket base capable of supporting a DUT carrying the integrated circuit, said socket base including electrical leads configured to connect to corresponding leads on the DUT;
- a socket lid;
- a thermally conductive heat spreader resiliently mounted within said socket lid, said heat spreader including a first thermal interface in releasable mechanical and thermal contact with the DUT in the socket;
- and
- a heat sink in thermal contact with a cooling medium and defining a second thermal interface with said heat spreader;
- wherein said heat spreader is biased toward the DUT by a spring affixed between said heat sink and said heat spreader.
A socket for testing an integrated circuit, comprising:
- a socket base capable of supporting a DUT carrying the integrated circuit, said socket base including electrical leads configured to connect to corresponding leads on the DUT;
- a socket lid;
- a thermally conductive heat spreader resiliently mounted within said socket lid, said heat spreader including a first thermal interface in releasable mechanical and thermal contact with the DUT in the socket;
- and
- a heat sink in thermal contact with a cooling medium and defining a second thermal interface with said heat spreader;
- wherein said second thermal interface includes an amount of a low melting point metal.
A socket for testing an integrated circuit, comprising:
- a socket base capable of supporting a DUT carrying the integrated circuit, said socket base including electrical leads configured to connect to corresponding leads on the DUT;
- a socket lid,
- a thermally conductive heat spreader resiliently mounted within said socket lid, said heat spreader including a first thermal interface in releasable mechanical and thermal contact with the DUT in the socket;
- and
- a heat sink in thermal contact with a cooling medium and defining a second thermal interface with said heat spreader;
- wherein said second thermal interface includes an amount of a low melting point metal contained in a foil skin that is affixed to said heat sink.
A socket for testing an integrated circuit, comprising:
- a socket base capable of supporting a DUT carrying the integrated circuit, said socket base including electrical leads configured to connect to corresponding leads on the DUT;
- a socket lid;
- a thermally conductive heat spreader resiliently mounted within said socket lid, said heat spreader including a first thermal interface in releasable mechanical and thermal contact with the DUT in the socket;
- and
- a heat sink in thermal contact with a cooling medium and defining a second thermal interface with said heat spreader;
- and
- further including a heater and a thermocouple adjacent to said thermal interface, said heater being controlled in response to output from said thermocouple.
A system for testing multiple integrated circuits, comprising:
- a plurality of sockets, each socket adapted to receive and support a DUT carrying an integrated circuit;
- a cooling system;
- and
- a plurality of thermally conductive members, each thermally conductive member in thermal contact with a first interface positioned to conduct heat from each DUT to a heat spreader and a second interface in thermal contact with said cooling system;
- wherein said thermally conductive members are movably mounted in the system and said second interface includes means for biasing said thermally conductive member toward the DUT.
Dependencies are inferred from the claim text.