Stretchable interconnects using stress gradient films

A sensor array comprising at least two electronic devices which are supported for movement relative to one another and at least one stretchable interconnect for connecting said electronic devices, said interconnect comprising:

• a photolithographically patterned stretchable conductor extending between said devices for electrically coupling a contact of one device to a contact of another device, said conductor being formed of a conductive material,
• wherein said interconnect comprises a coiled conductor which as patterned has a stress gradient extending through at least a portion of the thickness of said conductor, and
• wherein as photolitographically patterned and prior to coiling said interconnect comprises at least one “V ” shaped section which when unsupported, forms said coil.

A stretchable interconnect for electrically connecting electronic devices which are supported for movement relative to one another, comprising:

• a patterned stretchable conductor extending between two of said devices for electrically coupling a contact of one device to a contact of another device, said conductor being comprised of a conductive material,
• wherein said interconnect comprises a coiled conductor which as patterned has a stress gradient extending through at least a portion of the thickness of said conductor, and
• wherein as patterned and prior to coiling said interconnect comprises at least one section shaped to reduce stress concentration, which when unsupported forms said coil.

A sensor array comprising at least two electronic devices which are supported for movement relative to one another and at least one stretchable interconnect for connecting said electronic devices, said interconnect comprising:

• a patterned stretchable conductor extending between said devices for electrically coupling a contact of one device to a contact of another device, said conductor being formed of a conductive material,
• wherein said interconnect comprises a coiled conductor which as patterned has a stress gradient extending through at least a portion of the thickness of said conductor, and
• wherein as patterned and prior to coiling said interconnect comprises at least one section shaped to reduce stress concentration, which when unsupported forms said coil.