Electroless copper plating solution and high-frequency electronic component
AssigneeMurata Manufacturing Co., Ltd.
InventorsOsamu Kanoh, Kenji Yoshida
Life of this patent
Estimating the term…
Abstract
An electroless copper plating solution which can ensure superior adhesion of a copper plating film to a flat ceramic surface having low roughness and which can form a high-frequency electronic component having superior high-frequency conductivity and a high Q value is provided. Also provided is a high frequency electronic component formed by using this electroless copper plating solution. The electroless copper plating solution of contains copper ions, nickel ions, formaldehyde or a derivative thereof, and tartaric acid or a salt thereof. The ratio of the content of the nickel ions to that of the copper ions on a molar basis is in the range of about 0.0001 to 0.015.
Claims17
A method of forming a copper plated film on to a ceramic substrate comprising plating a copper plating film on a dielectric ceramic substrate comprising barium and titanium from an electroless copper plating solution comprising:
- copper salt;
- nickel salt;
- formaldehyde or a derivative thereof;
- and
- tartaric acid or a salt thereof and then heat treating the plated film.
Dependencies are inferred from the claim text.