Process for producing aluminum oxide films at low temperatures
AssigneeASM International N.V.
InventorsJarmo Skarp, Mervi Linnermo, Timo Asikainen
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AssigneeASM International N.V.
InventorsJarmo Skarp, Mervi Linnermo, Timo Asikainen
Estimating the term…
A process for producing aluminum oxide thin films on a substrate by the ALD method comprises the steps of bonding a vaporizable aluminum compound to a growth substrate, and converting the bonded organoaluminum compound to aluminum oxide. The bonded aluminum compound is converted to aluminum oxide by contacting it with a reactive vapor source of oxygen other than water, and the substrate is kept at a temperature of less than 190° C. during the growth process. By means of the invention it is possible to produce films of good quality at low temperatures. The dielectric thin films having a dense structure can be used for passivating surfaces that do not endure high temperatures. Such surfaces include, for example, polymer films such as organic electroluminescent displays. Further, when a water-free oxygen source is used, surfaces that are sensitive to water can be passivated.
A process of depositing a thin film of aluminum oxide on a substrate in a reaction chamber by an atomic layer deposition (ALD) process comprising a plurality of cycles, each cycle comprising:
A process of depositing a thin film of aluminum oxide on a substrate that is sensitive to moisture by an atomic layer deposition (ALD) process comprising a plurality of cycles, each cycle comprising:
A process of depositing a thin film of aluminum oxide on a substrate that is sensitive to the atmosphere by an atomic layer deposition (ALD) process comprising a plurality of cycles, each cycle comprising:
A process of depositing a thin film of aluminum oxide on a substrate in a reaction chamber by an atomic layer deposition (ALD) process comprising a plurality of cycles, each cycle comprising:
Dependencies are inferred from the claim text.