Epoxy hardener of imidazole or trihydric compound with methylol groups, trimethylolpropane and tetramethylguanidine (adduct)
AssigneeARDES Enterprises, Inc.
InventorRichard D. Schile
Life of this patent
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Abstract
An epoxy resin hardener having a cure temperature of between about 60° C. and 100° C. comprises a mixture of: a) an imidazole or a trihydric compound having methylol groups at the 2- and 6-positions formed by reacting a 4-alkylphenol with 2 moles of formaldehyde, b) trimethylopropane, and c) tetramethylguanidine or a tetramethylguanidine derived from the reaction of a monepoxide, a diepoxide, a phenol and formaldehyde, or a dihydric phenol and formaldehyde.
Claims7
An epoxy hardener composition having a cure temperature of between about 60-100° C., comprising a mixture of imidazole, trimethylolpropane and a tetramethylguanidine adduct formed as a reaction product of tetramethylguanidine and one of a monoepoxide, a diepoxide, a phenol and formaldehyde, and a dihydric phenol and formaldehyde.
An epoxy hardener composition having a cure temperature of between about 60-100° C., comprising a mixture of trimethylolpropane, a trihydric compound having methylol groups at the 2- and 6- positions formed by reacting a 4-alkyl phenol with 2 moles of formaldehyde, and a tetramethylguanidine adduct formed as a reaction product of tetramethylguanidine and one of a monoepoxide, a diepoxide, a phenol, and a dihydric phenol and formaldehyde.
An epoxy hardener composition having a cure temperature of between about 60-100° C., a mixture of trimethylolpropane, a trihydric compound having methylol groups at the 2- and 6- positions formed by reacting a 4-alkyl phenol with 2 moles of formaldehyde, and tetramethylguanidine.
Dependencies are inferred from the claim text.