Adhesiveless transfer lamination method and materials for producing electronic circuits
AssigneeParalec Inc.
InventorPaul H. Kydd
Life of this patent
Estimating the term…
Abstract
An electronic circuit is made by printing a Parmod® composition on a temporary substrate and curing it to produce a pattern of metal conductors. The conductors are laminated to a substrate under heat and pressure to produce a laminate with the metal prepatterned into the desired circuit configuration. The conductor can also be coated with a polymer and cured to form a prepatterned substrate. Single and double-sided circuits or multilayers can be made this way.
Claims15
A method for producing one or more patterned metal objects on a substrate comprising the steps of:
- a) applying a metal composition on a thermally resistant temporary substrate in the patterns of the one or more patterned metal objects;
- b) curing said metal composition at a temperature below about 450° C. for a time less than about 30 minutes to form the one or more patterned metal objects;
- c) transferring the one or more patterned metal objects from said temporary substrate to one side of the substrate without the use of a separately supplied adhesive
- wherein said metal composition is comprised of one or more metal powders in a reactive organic medium, said reactive organic medium consisting of one or more components selected from the group consisting of metallo-organic compounds which can decompose into elemental metal and volatile organic fragments, reagents which can react with said one or more metal powders to form metallo-organic compounds which can decompose into elemental metal and volatile organic fragments, and mixtures thereof.
A method for producing one or more patterned metal objects on a substrate comprising the steps of:
- a) applying a metal composition on a thermally resistant temporary substrate in the patterns of the one or more patterned metal objects;
- b) curing said metal composition at a temperature below about 450° C. for a time less than about 30 minutes to form the one or more patterned metal objects;
- c) transferring the one or more patterned metal objects from said temporary substrate to one side of the substrate without the use of a separately supplied adhesive;
- d) applying a metal composition on a second thermally resistant substrate in the patterns of additional one or more patterned metal objects;
- g) curing said metal composition at a temperature below about 450° C. for a time less than about 30 minutes to form said additional one or more patterned metal objects;
- h) transferring said additional one or more patterned metal objects from said second temporary substrate to the side of the substrate opposite to which said one or more patterned metal objects were transferred in step c);
- wherein step f) comprises placing a previously made double sided circuit and an additional substrate over said one or more patterned objects and then transferring said additional one or more patterned metal objects from said second temporary substrate to said substrate and previously made circuit to produce multiple layers;
- wherein said metal composition is comprised of one or more metal powders in a reactive organic medium, said reactive organic medium consisting of one or more components selected from the group consisting of metallo-organic compounds which can decompose into elemental metal and volatile organic fragments, reagents which can react with said one or more metal powders to form metallo-organic compounds which can decompose into elemental metal and volatile organic fragments, and mixtures thereof.
Dependencies are inferred from the claim text.