Bonding apparatus and bonding method of optical disks
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorMorio Tomiyama
Life of this patent
Estimating the term…
Abstract
An optical-disk bonding apparatus for bonding two or more disk substrates with an adhesive, has a turning table for clamping the disk substrates; a thickness gauge for measuring a thickness of bonding layers; and a rotation control unit for controlling the turning of a turning table; wherein the thickness of the bonding layers is measured with the thickness gauge on the turning table; and a rotation of the turning table or the pressure acting on the disk substrates is controlled based on the measured thickness data.
Claims6
An optical-disk bonding apparatus for bonding two or more disk substrates with an adhesive, comprising:
- a first table for clamping said disk substrates;
- a thickness gauge for measuring a thickness of bonding layers at least at one point on said disk substrates;
- a second table for holding another substrate to be bonded face to face to said disk substrates;
- and a pressurizing mechanism for bonding said disk substrates under pressure by moving said second table and said first table closer to each other;
- wherein
- the thickness of said bonding layers is measured with said thickness gauge;
- and the pressure applied by said pressurizing mechanism is controlled, based on the measured thickness data, and said thickness gauge is an instrument which directs a laser beam with a wavelength between 600 nm and 700 nm onto the bonding layer.
An optical-disk bonding apparatus for bonding two or more disk substrates with an adhesive, comprising:
- a first table for clamping said disk substrates;
- a thickness gauge for measuring a thickness of bonding layers at least at one point on said disk substrates;
- a second table for holding another substrate to be bonded face to face to said disk substrates;
- and a pressurizing mechanism for bonding said disk substrates under pressure by moving said second table and said first table closer to each other;
- wherein
- the thickness of said bonding layers is measured with said thickness gauge;
- and the pressure applied by said pressurizing mechanism is controlled, based on the measured thickness data, and
- the second table for pressing another substrate to be bonded face to face to said disk substrates is a table made of material virtually transparent to light with wavelengths between 600 nm and 700 nm.
An optical-disk bonding method, wherein two disk substrates are bonded by holding them between two tables, a thickness of the bonding layer that bonds the disk substrates is measured by an instrument which directs a laser beam with a wavelength between 600 nm and 700 nm onto the bonding layer, and the thickness of the bonding layer is controlled to within a designated range by controlling the pressing force of said tables based on the measured thickness data.
Dependencies are inferred from the claim text.