Gel-free colloidal abrasive polishing compositions and associated methods
AssigneeDuPont Air Products NanoMaterials LLC
InventorsPeter Jernakoff, Junaid Ahmed Siddiqui
Life of this patent
Estimating the term…
Abstract
Gel-free colloidal abrasive polishing compositions and associated methods for polishing (e.g., chemical mechanical polishing) are described. These abrasive polishing compositions are comprised of a surface-modified colloidal abrasive that has been modified with a boron-containing compound(s), such as boron surface-modified colloidal ceria or silica. These compositions are useful in chemical mechanical planarization (CMP) applications as well as in substrate polishing applications. These abrasive compositions are most often negatively-charged colloids, which remain as stable negatively-charged colloids even in acidic media.
Claims13
A composition for chemical-mechanical planarization comprising:
- A) a boron surface-modified colloidal abrasive containing a boron compound on the surface of the abrasive, wherein the boron compound is present on the surface of the abrasive at a level of at least 20 percent of available surface sites;
- and
- B) an acid.
A composition for chemical-mechanical planarization comprising:
- A) a boron surface-modified colloidal abrasive containing a boron compound on the surface of the abrasive, wherein the abrasive is selected from the group consisting of colloidal ceria and colloidal titania;
- and
- B) an acid.
A method of chemical-mechanical planarization comprising the steps of:
- A) placing a substrate in contact with a polishing pad;
- B) delivering a composition comprising:
- a) a boron surface-modified colloidal abrasive containing a boron compound on the surface of the abrasive, wherein the boron compound is present on the surface of the abrasive at a level of at least 20 percent of available surface sites;
- and
- b) an acid;
- and
- C) at least partially planarizing the substrate with the composition.
A method of chemical-mechanical planarization comprising the steps of:
- A) placing a substrate in contact with a polishing pad;
- B) delivering a composition comprising:
- a) a boron surface-modified colloidal abrasive containing a boron compound on the surface of the abrasive, wherein the abrasive is selected from the group consisting of colloidal ceria and colloidal titania;
- and
- b) an acid;
- and
- C) at least partially planarizing the substrate with the composition.
Dependencies are inferred from the claim text.