Back to results
US 6,743,069 B2Granted
Facilitating the spread of encapsulant between surfaces of electronic devices
AssigneeIntel Corporation
InventorPonnusamy Palanisamy
Life of this patent
Estimating the term…
Abstract
An electronic device having an extensive narrow passageway may be effectively encapsulated by forming openings in one or more of the surfaces defining the encapsulation region. Encapsulation material may then be injected through these openings to fill a narrow, difficult to access region between two surfaces being encapsulated. In some cases, the encapsulant may be applied progressively, starting with a central port and applying the encapsulant in a radially expanding front through radially displaced ports.
Claims13
A method comprising:
- coupling a first and second surface of an electronic device in spaced apart relationship so as to form a region between said first and second surfaces;
- forming a centrally located hole in one of said surfaces;
- forming a plurality of radially displaced holes arranged at a substantially uniform radius from said centrally located hole;
- and
- injecting an encapsulant between said first and second surfaces through said centrally located hole until the encapsulant reaches said radially displaced holes and thereafter stopping the injection of encapsulant through said centrally located hole and injecting encapsulant through said radially displaced holes.
2 more elements
A method comprising:
- injecting encapsulant into an electronic device at a first location;
- and
- when the encapsulant reaches a second location spaced from said first location, injecting encapsulant at a location proximate to said second location.
A method comprising:
- forming a centrally located hole in a first surface of an electronic device;
- forming a plurality of radially displaced holes arranged at substantially uniform radius from said centrally located hole in a first or a second surface;
- coupling the first and second surface of an electronic device;
- and
- injecting an encapsulant between said first and second surfaces through said centrally located hole until the encapsulant reaches said radially displaced hole and thereafter stopping the injection from encapsulant through said centrally located hole and injecting encapsulant through said radially displaced holes.
2 more elements
Dependencies are inferred from the claim text.