Surface mount socket contact providing uniform solder ball loading and method

A surface mount socket comprising:

• at least one contact therein, the contact having an upper end, an intermediate section, and a lower end;
• wherein the upper end is adapted to accommodate an electrical contact, whereas the intermediate section is adapted to flex under compressive load, and the lower end remains within the socket and is adapted to accommodate a preformed solder element secured thereto wherein when a solder element is in place:
• only a portion of the element extends beyond the socket;
• ensuring a uniform compressive load force transmitted from the socket through the intermediate flex section to the solder element;
• while simultaneously limiting the solder ball travel to the distance the solder element extends beyond the socket;
• when the socket and solder element are forced into contact with a circuit board;
• prior to a reflow process that secures the socket, via reflow solder, to the circuit board.

A contact for a surface mount socket, the contact comprising:

• an upper end, an intermediate section, and a lower end,
• the upper end is adapted to receive an electrical contact, whereas the intermediate section is adapted to flex under compressive load, and the lower end is adapted to accommodate a preformed reflow element secured thereto, wherein, when a reflow element is in place:
• a compressive load force may be transmitted from the socket through the intermediate flex section to the reflow element;
• and
• reflow element travel is limited to the distance the reflow element extends beyond the socket:
• when the reflow element contacts with a substrate;
• prior to a reflow process secures the socket, via reflow, to the substrate.

An electronic system comprising:

• at least one of an input device and output device;
• and
• a surface mount socket including:
• at least one contact therein, the contact having an upper end, an intermediate section, and a lower end, the upper end is adapted to receive an electrical contact, whereas the intermediate section is adapted to flex under compressive load, and the lower end is adapted to accommodate a preformed reflow element secured thereto, wherein, when a reflow element is in place:
• a compressive load force may be transmitted from the socket through the intermediate flex section to the reflow element;
• and
• reflow element travel is limited to the distance the reflow element extends beyond the socket:
• when the reflow element contacts with a substrate;
• prior to a reflow process secures the socket, via reflow, to the substrate.