US 6,742,561 B2 · Apparatus for die bonding

Abstract

The present invention provides an apparatus for bonding a semiconductor chip to substrate using a non-conductive adhesive tape. The non-conductive adhesive tape may be a polyimide tape. The apparatus may include a tape provider having a reel on which the non-adhesive tape may be spooled, rollers, and a tape cutter which cuts the tape to a suitable size. A tape holder and a tape presser may also be provided to hold the tape in place while the tape cutter cuts the tape. A tape pick-up tool may be provided to transfer the cut tape to a die bonding area on the substrate. The tape holder and the tape pick-up tool may include a suction opening for providing a suction force. The apparatus may further include a die pick up tool for transferring a semiconductor chip from a semiconductor chip provider to the adhesive tape affixed to the substrate.

Claims8

Dependent claims

An apparatus for bonding a semiconductor chip to a substrate comprising:

a stacker in which a substrate is loaded;
a tape provider which provides an adhesive tape for bonding the semiconductor chip to the substrate;
a tape pick-up tool which adheres to a top surface of a piece of the adhesive tape, removes the piece of adhesive tape from the tape provider and transports the piece of the adhesive tape from the tape provider to a bonding pad of the substrate, wherein the substrate is offset from the tape provider in at least a lateral direction;
a semiconductor chip provider in which the semiconductor chip is contained;
a die pick-up tool which transports the semiconductor chip from the semiconductor chip provider;
and
a presser which presses the semiconductor chip placed on the piece of adhesive tape to bond the semiconductor chip to the substrate.

4 more elements

Dependencies are inferred from the claim text.

Apparatus for die bonding

Life of this patent

Apparatus for die bonding

Life of this patent

Abstract

Claims8