Method of manufacturing wiring substrate
AssigneeNgk Spark Plug Co., Ltd.
InventorKazuyuki Takahashi
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a wiring substrate 1 includes a conductor layer forming step for forming a second conductor layer 29, through electroless copper plating and copper electroplating, on a first resin dielectric layer 7, which is surface-roughened to a predetermined roughness and to which palladium adheres; a cyan treatment step for cleaning a substrate 41 on which the second conductor layer 29 is formed, using a cyanide-containing solution; and an upper resin dielectric layer forming step for forming a second resin dielectric layer 9 on the first resin dielectric layer 7 and the second conductor layer 29 of the cyan-treated substrate 41.
Claims11
A method for manufacturing a wiring substrate including a resin dielectric layer, a conductor layer formed in a predetermined pattern on the resin dielectric layer, and an upper resin dielectric layer formed on the resin dielectric layer and on the conductor layer, comprising:
- a conductor layer forming step of forming the conductor layer, through electroless copper plating and copper electroplating, on the resin dielectric layer of the substrate, the resin dielectric layer having a surface which has been surface-roughened to a predetermined roughness and to which palladium adheres;
- a cyan treatment step of cleaning the substrate, on which the conductor layer has been formed, with a cyanide-containing solution;
- and
- an upper resin dielectric layer forming step of forming an upper resin dielectric layer on the resin dielectric layer and the conductor layer of the cyan-treated substrate.
A method for manufacturing a wiring substrate including a resin dielectric layer, a conductor layer of a predetermined pattern formed on the resin dielectric layer, and an upper resin dielectric layer formed on the resin dielectric layer and on the conductor layer, comprising:
- an electroless copper plating step of forming an electroless copper plating layer, through electroless copper plating, on the resin dielectric layer of the substrate, the resin dielectric layer having a surface which has been surface-roughened to a predetermined roughness and to which palladium adheres;
- a drying step of drying the substrate on which the electroless copper plating layer has been formed, at a temperature not higher than about 85° C.;
- a plating resist layer forming step of forming, after the drying step, a plating resist layer of a predetermined pattern on the electroless copper plating layer;
- a copper electroplating step of forming a copper electroplating layer, through copper electroplating, on the electroless copper plating layer exposed through the plating resist layer;
- a plating resist layer removing step of removing, after the copper electroplating step, the plating resist layer;
- an etching-away step of etching away the electroless copper plating layer except where the same is overlaid with the copper electroplating layer, thereby forming the conductor layer;
- a cyan treatment step of cleaning the substrate, on which the conductor layer has been formed, using a cyanide-containing solution;
- and
- an upper resin dielectric layer forming step of forming an upper resin dielectric layer on the resin dielectric layer and the conductor layer of the cyan-treated substrate.
Dependencies are inferred from the claim text.