Structures for improving heat dissipation in stacked semiconductor packages

A semiconductor package comprising:

• a substrate;
• a first die on and electrically coupled to the substrate by bond wires;
• a metal support structure on the substrate over the first die and the bond wires, said support structure including a first side and an opposite second side facing the first die, said support structure being electrically coupled to the substrate;
• a second die coupled to the second side of the support structure over the first die and the bond wires and electrically coupled to the substrate;
• and
• a hardened unitary body of an encapsulant material covering the first die, the support structure, and the second die, wherein the encapsulant material is vertically between the first die and the second die.

A semiconductor package comprising:

• a substrate;
• a first die on and electrically coupled to the substrate;
• a support structure on the substrate over the first die, said support structure including a first side facing the first die and an opposite second side including a recess;
• a second die coupled to the second side of the support structure over the first die and within the recess, said second die being electrically coupled to the substrate;
• and
• a hardened unitary body of an encapsulant material covering the first die, the support structure, and the second die.