Manufacturing method for an electronic apparatus and electronic apparatus with plastic housing
AssigneeSiemens Aktiengesellschaft
InventorHarald Schmidt
Life of this patent
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Abstract
A method of manufacturing an electronic apparatus having a plastic housing. The method includes blow molding with a one-piece plastic housing around an electronic circuit board populated with components. The circuit board is fastened and held in-situ during the blow molding. Fastening locations are defined by contiguously sandwiched portions of the housing and the electronic circuit board.
Claims12
A method for transferring impulses from a vehicle body to an electronic sensor, the method comprising:
- mounting the electronic sensor on an electronic circuit board;
- blow molding a one-piece plastic housing around the electronic circuit board and the sensor such that the electronic circuit board is secured to the plastic housing;
- and
- fixing the one-piece plastic housing to the vehicle body.
A method for transferring impulses from a vehicle body to an electronic sensor, the method comprising:
- mounting the electronic sensor on an electronic circuit board;
- blow molding a one-piece plastic housing around the electronic circuit board and the sensor such that the electronic circuit board is secured to the plastic housing;
- fixing the one-piece plastic housing to the vehicle body;
- and
- providing an electronic terminal strip fixed to the electronic circuit board;
- wherein the blow molding includes blowing fluid through the electronic terminal strip to form the plastic housing.
An electronic apparatus, comprising:
- a one-piece plastic housing made by blow molding;
- an electronic circuit board secured in-situ during blow molding the plastic housing;
- at-least one location wherein the plastic housing contiguously sandwiches the electronic circuit board;
- and wherein a first at-least one location includes a mounting hole penetrating the plastic housing and the electronic circuit board.
An electronic apparatus, comprising:
- a one-piece plastic housing made by blow molding;
- an electronic circuit board secured in-situ during blow molding the plastic housing;
- at-least one location wherein the plastic housing contiguously sandwiches the electronic circuit board;
- wherein the electronic circuit board includes a first surface, a second surface generally oppositely facing from the first surface, and an aperture extending between the first and second surfaces at one at-least one location;
- and the plastic housing includes a first portion contiguously engaging the first surface at the one at-least one location, a second portion contiguously engaging the second surface at the one at-least one location, and an annular portion contiguously engaging the aperture and extending through the electronic circuit board.
An electronic apparatus, comprising:
- a one-piece plastic housing made by blow molding;
- an electronic circuit board secured in-situ during blow molding the plastic housing;
- at-least one location wherein the plastic housing contiguously sandwiches the electronic circuit board;
- and wherein the one-piece plastic housing defines at least one cavity around the electronic circuit board.
Dependencies are inferred from the claim text.