Plastic packaging of LED arrays

A method of forming a packaged solid state device, comprising:

• placing a plurality of feed through electrodes into a mold cavity;
• filling the mold cavity with a fluid insulating material;
• solidifying the fluid insulating material to form an insulating rigid carrier, such that first surfaces of the feed through electrodes are exposed in a first surface of the rigid carrier and second surfaces of the feed through electrodes are exposed in a second surface of the rigid carrier after solidification;
• adhering the first side of the rigid carrier over a first side of a flexible module base, wherein the flexible module base comprises an insulating material;
• forming a conductive interconnect pattern having a first portion over a second side of the flexible module base and a plurality of second portions extending through the flexible module base and contacting the exposed first surfaces of the feed through electrodes;
• and
• forming at least one light emitting diode on the second side of the rigid carrier and in electrical contact with the exposed second surfaces of the feed through electrodes.

A method of forming a packaged solid state device, comprising:

• placing a plurality of feed through electrodes into a mold cavity;
• filling the mold cavity with a fluid insulating material;
• solidifying the fluid insulating material to form an insulating rigid carrier, such that first surfaces of the feed through electrodes are exposed in a first surface of the rigid carrier and second surfaces of the feed through electrodes are exposed in a second surface of the rigid carrier after solidification;
• forming a conductive interconnect pattern having a first portion over a second side of a flexible module base and a plurality of second portions extending through the flexible module base, wherein the flexible module base comprises an insulating material;
• adhering the first side of the rigid carrier over a first side of a flexible module base using an anisotropic adhesive layer;
• and
• forming at least one light emitting diode on the second side of the rigid carrier and in electrical contact with the exposed second surfaces of the feed through electrodes;
• wherein:
• the anisotropic adhesive layer is located between the first side of the rigid carrier and the first side of the flexible module base and in electrical contact with the exposed first sides of the feed through electrodes;
• and
• the anisotropic adhesive layer is electrically conductive substantially along a first axis between the rigid carrier and the flexible module base, but is electrically insulating substantially along a direction perpendicular to the first axis.