Dynamic structural coupling mechanism for reducing optical degradation in vibrating environments

A method of microprobing a semiconductor device on top of a integrated circuit tester, said method comprising

• a) viewing the semiconductor device through a video microscope, said video microscope comprising an objective lens and a video camera,
• b) connecting the video microscope to a microscope movement means which in turn are connected to a mounting means,
• c) microprobing using microprobing means which are rigidly placed on top of the integrated circuit tester, and
• d) vibration damping using a computer controlled clamping device which couples the integrated circuit tester to the video microscope, said clamping device being disabled when the video microscope is to be moved, and the clamping device being enabled when the movement is complete, allowing the video microscope to vibrate in unison with the tester, thereby reducing the relative motion between the microscope and tester, said vibration damping including using at least one piston driven rod coupled to the video microscope and which engages the integrated circuit tester when actuated.