Back to results
US 6,731,003 B2Granted
Wafer-level coated copper stud bumps
AssigneeFairchild Semiconductor Corporation
InventorsRajeev Joshi, Consuelo Tangpuz, Erwin Victor R. Cruz
Life of this patent
Estimating the term…
Abstract
A method for forming a semiconductor die package is disclosed. In one embodiment, the method includes forming a semiconductor die comprising a semiconductor device. A plurality of copper bumps is formed on the semiconductor die using a plating process. An adhesion layer is formed on each of the copper bumps, and a noble metal layer is formed on each of the copper bumps.
Claims17
A method comprising:
- (a) forming a plurality of copper bumps on a semiconductor die using a plating process, wherein the semiconductor die comprises a semiconductor device;
- (b) forming an adhesion layer on each copper bump in the plurality of copper bumps;
- and
- (c) forming an oxidation resistant layer on each copper bump in the plurality of copper bumps, wherein the adhesion layer is between the oxidation resistant layer and the copper bump.
1 more element
A method comprising:
- (a) forming a plurality of copper bumps on a semiconductor die using a plating process, wherein the semiconductor die comprises a semiconductor device;
- (b) forming an adhesion layer comprising nickel on each copper bump in the plurality of copper bumps;
- (c) forming an oxidation resistant layer comprising gold on each copper bump in the plurality of copper bumps, wherein the adhesion layer is between the oxidation resistant layer and the copper bump to form a coated copper bump;
- and
- (d) bonding the coated copper bump to a conductive region of a circuit substrate using solder.
2 more elements
A bumped semiconductor die comprising:
- (a) a semiconductor die comprising a semiconductor device;
- (b) a plated copper bump on the semiconductor die, the plated copper bump having a top surface;
- (c) an adhesion layer on at least the top surface of the plated copper bump;
- and
- (d) an oxidation resistant layer on the adhesion layer.
2 more elements
Dependencies are inferred from the claim text.