Mountable microstructure and optical transmission apparatus
AssigneeSeiko Epson Corporation
InventorsTakayuki Kondo, Tatsuya Shimoda
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AssigneeSeiko Epson Corporation
InventorsTakayuki Kondo, Tatsuya Shimoda
Estimating the term…
A mountable microstructure is provided for mounting with high positional accuracy a compound semiconductor element such as a surface emitting laser element engaged under gravity in concavities on an upper surface of a substrate. A surface emitting laser element 2 is formed on an upper surface of a Si block 1 formed at high accuracy in the same shape as concavities on the upper surface of a substrate by Si anisotropic etching. In the case of a surface emitting laser, since problems such as lattice mismatch occur when an epitaxial layer is grown on the Si substrate, the epitaxial layer 14 is grown on for example a GaAs substrate 11, and this is inverted to bond onto an Si substrate 17. Then after forming the surface emitting laser element 2, the Si block is shaped and divided up by anisotropic etching. Other elements may be formed on the Si block, however, in order to individually drive compound semiconductor elements, a high resistance layer 23 or a current blocking layer 24 is installed in an internal layer 22 between the two. If electrodes are provided on the upper surface of the Si substrate 17, prober inspection is facilitated.
A mountable microstructure which is engaged and mounted in a concavity formed at a predetermined location on an upper surface of a base substance, by mixing in a fluid to form a slurry and flowing the slurry over the upper surface of said base substance, wherein there is provided an Si block of a shape for engaging in said concavity on the upper surface of said base substance, and a compound semiconductor element formed on an upper surface of said Si block,
A mountable microstructure which is engaged and mounted in a concavity formed at a predetermined location on an upper surface of a base substance, by mixing in a fluid to form a slurry and flowing the slurry over the upper surface of said base substance, wherein there is provided an Si block of a shape for engaging in said concavity on the upper surface of said base substance, and a compound semiconductor element formed on an upper surface of said Si block;
A mountable microstructure which is engaged and mounted in a concavity formed at a predetermined location on an upper surface of a base substance, by mixing in a fluid to form a slurry and flowing the slurry over the upper surface of said base substance, wherein there is provided an Si block of a shape for engaging in said concavity on the upper surface of said base substance, and a compound semiconductor element formed on an upper surface of said Si block;
A mountable microstructure which is engaged and mounted in a concavity formed at a predetermined location on an upper surface of a base substance, by mixing in a fluid to form a slurry and flowing the slurry over the upper surface of said base substance, wherein there is provided an Si block of a shape for engaging in said concavity on the upper surface of said base substance, and a compound semiconductor element formed on an upper surface of said Si block;
A mountable microstructure which is engaged and mounted in a concavity formed at a predetermined location on an upper surface of a base substance, by mixing in a fluid to form a slurry and flowing the slurry over the upper surface of said base substance, wherein there is provided an Si block of a shape for engaging in said concavity on the upper surface of said base substance, and a compound semiconductor element formed on an upper surface of said Si block;
An optical transmission apparatus comprising:
An optical transmission apparatus having a light emitting section comprising:
Dependencies are inferred from the claim text.