# US 6,730,532 B1 · Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process

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- Number: US 6,730,532 B1
- Document ID: US6730532B1
- Status: Granted
- Kind: B1
- Application number: 10/086,050
- Filed: 2002-02-27
- Granted: 2004-05-04
- Earliest claimed: 2001-02-27
- Assignees: Cypress Semiconductor Corporation
- Inventors: Bo Soon Chang; Vani Verma
- Web page: https://patentgrep.com/patent/US6730532B1

## CPC

- H10W 46/00: Marks applied to devices, e.g. for alignment or identification
- H10P 54/00: Cutting or separating of wafers, substrates or parts of devices
- H10P 72/0428: {Apparatus for mechanical treatment or grinding or cutting}
- H10P 72/0604: {Process monitoring, e.g. flow or thickness monitoring}
- H10P 72/0611: {Sorting devices}
- G05B 2219/31293: Enter size measurements, store in data base, analyze and identify in size data group
- G05B 2219/45048: Packaging
- H10W 46/601: {for use after dicing}
- Y02P 80/40: Minimising material used in manufacturing processes
- Y02P 90/80: Management or planning
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- G05B: CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS (systems for controlling or regulating non-electric variables G05D; systems for regulating electric or magnetic variables G05F; control devices or systems insofar as characterised by mechanical features only G05G)
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

A method and system for universal packaging in conjunction with an automated in-line back-end IC manufacturing process. In one method embodiment, the present invention processes a die-strip through a number of integrated in-line processes that function independently of the die size of the die-strip. A control computer maintains a die-strip map database recording the die size of the die-strip. In-line molding and solder ball attachment processes are then performed and function independently of the die size of the die-strip. Processes that are independent of die size provide a universal packaging manufacturing solution. The present invention then accesses the database to determine the die size for cutting the die-strip based on specifications maintained by the electronic die-strip map database. Sorting, testing and finish assembly processes are then performed.

## Claims

### Claim 1

A method for universal packaging in a back-end IC manufacturing process comprising:
traversing a die-strip through a front-of-line portion of said back-end manufacturing process and a part of an end-of line portion of said back-end manufacturing process, wherein said front-of-line portion and said part of said end-of-line portion function independently of the die size of said die-strip;
accessing an electronic die-strip database stored in a computer system to determine said die size of said die-strip; and
based on said die size, cutting said die-strip into individual devices.

### Claim 2 (depends on 1)

A method as described in claim 1 further comprising sorting said individual devices, wherein said sorting is dependent on said die size.

### Claim 3 (depends on 1)

A method as described in claim 1 comprising controlling said front-of-line portion, said part of said end-of line portion, said cutting and said sorting using said computer system.

### Claim 4 (depends on 1)

A method as described in claim 1 wherein said part of said end-of-line portion comprises an automated in-line molding process and wherein said traversing comprises processing said die-strip through said automated in-line molding process that functions independently of said die size.

### Claim 5 (depends on 4)

A method as described in claim 4 wherein said part of said end-of-line portion further comprises an automated in-line ball attachment process and wherein said traversing further comprises processing said die-strip through said automated in-line ball attachment process that functions independently of said die size.

### Claim 6 (depends on 5)

A method as described in claim 5 wherein said in-line ball attachment process is utilized on both plastic and copper.

### Claim 7 (depends on 1)

A method as described in claim 1 wherein said cutting is performed using an integrated in-line sawing process of said end-of-line portion.

### Claim 8 (depends on 1)

A method as described in claim 1 wherein said front-of-line portion comprises an in-line die-attachment process; an in-line cure process; a first in-line plamsa process; an in-line bond process; and a second in-line plasma process and wherein said traversing comprises:
processing said die-strip through said in-line die-attachment process that functions independently of said die size;
processing said die-strip through said in-line cure process that functions independently of said die size;
processing said die-strip through said first in-line plasma process that functions independently of said die size;
processing said die-strip through said in-line bond process that functions independently of said die size; and
processing said die-strip through said second in-line plasma process that functions independently of said die size.

### Claim 9 (depends on 1)

A method as described in claim 1 further comprising traversing said individual devices through a test process and a finish assembly processes which produce taped and reeled products.

### Claim 10

A method for universal packaging in a back-end IC manufacturing process comprising:
traversing a die-strip through a front-of-line portion of said back-end manufacturing process, a mold process and a ball attachment process, wherein said front-of-line portion, said mold process and said ball attachment process all function independently of the die size of said die-strip;
receiving data identifying said die size of said die-strip and storing said die size into a database;
using a computer control system to access said database to obtain said die-size; and
based on said die size, cutting said die-strip into individual devices.

### Claim 11 (depends on 10)

A method as described in claim 10 further comprising sorting said individual devices, wherein said sorting is dependent on said die size.

### Claim 12 (depends on 10)

A method as described in claim 10 wherein said processes of said front-of-line portion, said mold process and said ball attachment process are integrated in-line processes of said back-end manufacturing process.

### Claim 13 (depends on 12)

A method as described in claim 12 wherein said ball attachment process is utilized on both plastic and copper.

### Claim 14 (depends on 10)

A method as described in claim 10 wherein said cutting is performed using an integrated in-line sawing process of said end-of-line portion.

### Claim 15 (depends on 10)

A method as described in claim 10 wherein said front-of-line portion comprises an in-line die-attachment process; an in-line cure process; a first in-line plamsa process; an in-line bond process; and a second in-line plasma process and wherein said traversing comprises:
processing said die-strip through said in-line die-attachment process that functions independently of said die size;
processing said die-strip through said in-line cure process that functions independently of said die size;
processing said die-strip through said first in-line plasma process that functions independently of said die size;
processing said die-strip through said in-line bond process that functions independently of said die size; and
processing said die-strip through said second in-line plasma process that functions independently of said die size.

### Claim 16 (depends on 10)

A method as described in claim 10 further comprising traversing said individual devices through a test process and finish assembly processes which produce taped and reeled products.