# US 6,725,115 B2 · Dynamic testing of electronic assemblies

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- Number: US 6,725,115 B2
- Document ID: US6725115B2
- Status: Granted
- Kind: B2
- Application number: 09/850,241
- Filed: 2001-05-07
- Published: 2002-06-13
- Granted: 2004-04-20
- Earliest claimed: 2000-05-08
- Assignees: Teradyne, Inc.
- Inventors: Douglas W. Raymond; Nelson R. Saldana; John F. Wood
- Web page: https://patentgrep.com/patent/US6725115B2

## CPC

- G01R 31/2806: {Apparatus therefor, e.g. test stations, drivers, analysers, conveyors (G01R31/2805, G01R31/281, G01R31/2818 take precedence)}
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)

## Abstract

Method and apparatus for providing dynamic testing of electronic assemblies during their manufacture. A production line includes a communication network to interconnect assembly and inspection equipment. Events impacting the manufacture of the assemblies are communicated among the equipment, allowing the testing to be dynamically adjusted in response to events. Dynamic adjustment allows the process to quickly detect defects introduced by events. The concept is illustrated with a production line that has a pick and place machine and an inspection station. When an operator changes a reel of components at the pick and place machine, the inspection station will switch test programs to quickly verify that the correct reel has been loaded.

## Claims

### Claim 1

An production line adapted for dynamic testing of electronic assemblies, comprising:
a) at least one assembly machine;
b) at least one inspection machine, programmed with at least a first program and a second program for identifying defects on electronic assemblies produced by the assembly machine;
c) a communication network passing information between the assembly machine and the inspection machine;
d) wherein the communication network passes information from the assembly machine to the inspection machine concerning an event that could cause defects in the manufacture of the electronic assemblies; and
e) wherein, in response to receiving the indication of the event, the at least one inspection machine switches from using the first program to using the second program to inspect electronic assemblies.

### Claim 2 (depends on 1)

The production line of claim 1 wherein the first program is a sampling program.

### Claim 3 (depends on 1)

The production line of claim 1 wherein the first program inspects different regions on successive electronic assemblies.

### Claim 4 (depends on 1)

The production line of claim 1 wherein the at least one assembly machine comprises a pick and place machine.

### Claim 5 (depends on 1)

The production line of claim 1 wherein the at least one inspection machine comprises an AOI machine.

### Claim 6 (depends on 1)

The production line of claim 1 wherein the at least one inspection machine comprises an AOI machine and a pick and flying prober machine.

### Claim 7 (depends on 1)

The production line of claim 1 wherein the at least one inspection machine comprises a flying prober machine.

### Claim 8 (depends on 1)

A method of manufacturing printed circuit boards using the production line of claim 1 comprising:
a) assembling a board with the assembly machine;
b) selecting one of the first program and the second program in response to an indication of an event; and
c) inspecting the board with the inspection machine using the selected program.

### Claim 9

An production line adapted for dynamic testing of electronic assemblies, comprising:
a) at least one assembly machine;
b) at least one inspection machine, programmed with at least a first program and a second program for identifying defects on electronic assemblies produced by the assembly machine;
c) a communication network passing information between the assembly machine and the inspection machine;
d) wherein the communication network passes information from the assembly machine to the inspection machine concerning an event that could cause defects in the manufacture of the electronic assemblies; and
e) wherein, in response to receiving the indication of the event, the at least one inspection machine switches from using the first program to using the second program to inspect electronic assemblies,
wherein:
i) the at least one inspection machine comprises at least two inspection machines and
ii) the production line additionally comprises a switch routing electronic assemblies to the second assembly machine in response to the event; and
iii) the second program runs on the second inspection machine.

### Claim 10

An inspection machine adapted for use in a production line capable of performing dynamic testing of electronic assemblies, comprising:
a) inspection apparatus selected from the class consisting of AOI and flying prober;
b) a controller, connected to the inspection apparatus, the controller having:
i) at least a first software program and a second software program;
ii) a connection to a communications network;
iii) software adapted to receive event messages over the communications network and to select either the first program or the second program in response to an event message;
iv) wherein an event is a change in the process for manufacturing electronic assemblies selected from the group consisting of a reel change and a jam.

### Claim 11 (depends on 10)

The inspection machine of claim 10 wherein the first software program is adapted to inspect different regions of successive electronic assemblies and the second software program is adapted to inspect specific components on the electronic assemblies.

### Claim 12 (depends on 11)

The inspection machine of claim 11 wherein the specific component inspected by the second program are selected in response to the event message.

### Claim 13 (depends on 10)

The inspection machine of claim 10 wherein the communications network comprises a GEM network.

### Claim 14

An inspection machine adapted for use in a production line capable of performing dynamic testing of electronic assemblies, comprising:
a) inspection apparatus;
b) a controller, connected to the inspection apparatus, the controller having:
i) at least a first software program and a second software program;
ii) a connection to a communications network;
iii) control software adapted to receive event messages over the communications network and to select either the first program or the second program in response to an event message;
iv) wherein the event message includes an indicator of an electronic assembly affected by the event and the time at which the control software selects between the first program and the second program is determined by the time at which said electronic assembly is inspected.

### Claim 15 (depends on 14)

The inspection machine of claim 14 wherein the first software program is adapted to inspect different regions of successive electronic assemblies and the second software program is adapted to inspect specific components on the electronic assemblies.

### Claim 16 (depends on 15)

The inspection machine of claim 15 wherein the specific component inspected by the second program are selected in response to the event message.

### Claim 17 (depends on 14)

The inspection machine of claim 14 wherein the communications network comprises a GEM network.

### Claim 18 (depends on 14)

The inspection apparatus of claim 14 wherein the inspection apparatus is selected from the class consisting of AOI and flying prober.

### Claim 19 (depends on 14)

The inspection machine of claim 14 wherein the first program is a sampling program.

### Claim 20 (depends on 14)

The inspection machine of claim 14 wherein the first program inspects different regions on successive electronic assemblies and the second program is used on the first assembly affected by the event and a plurality of assemblies in sequence thereafter.
